Home » Competitions » Distributed Design Scholarship Competition 2021 > IAAC’s Master in Design for Emergent Futures

Distributed Design Scholarship Competition 2021 > IAAC’s Master in Design for Emergent Futures

Win a Scholarship for the Master in Design for Emergent Futures 2021-2022

Distributed Design Platform and Fab Lab Barcelona at IAAC are offering one scholarship for a Europe based designer for the Master in Design for Emergent Futures (MDEF) 4th Edition (October 2021 – June 2022).

MDEF may be a 9 month theoretical and practical program that engages the expertise of Fab Lab Barcelona, the Institute for Advanced Architecture Catalonia (IAAC) and Elisava, Barcelona School of Design and Engineering. It evolves the practice of design beyond objects, aesthetics, form-finding and pure speculation through a singular hands-on learning approach.

Distributed Design may be a European Platform co-Funded by the Creative Europe programme of the ecu Union. It aims to support and connect creatives, designers, makers, and innovators to participate within the creation of a replacement model of production and consumption – Distributed Design envisions a world during which “bits travel globally, while atoms stay local.” The Platform is coordinated by Fab Lab Barcelona and comprises 17 member organisations from 13 countries in Europe including the Danish Design Centre, Innovation Centre Iceland and Polifactory, Politecnico di Milano. The platform delivers over 40 events yearly to audiences on and offline of over 1 million. Platform activities include residencies, Awards and Summer Schools, in 2021 this might also include programming like Maker to plug Accelerator, which Scholarship winners are going to be invited to hitch .

The scholarship covers 50% of the total tuition costs of the MDEF program for one designer as well as the opportunity to participate in yearly activities of the Distributed Design Platform.

  • Title

    Distributed Design Scholarship Competition 2021 > IAAC’s Master in Design for Emergent Futures
  • Type

    Grants, Scholarships & Awards
  • Website

    https://iaac.net/mdef-dd-scholarship-competition/
  • Organizers

    Institute for Advanced Architecture of Catalonia
  • Submission Deadline

    April 30, 2021 11:30 PM
  • Price

    Free

Further Reading From ArchUp

  • Mountain Sanctuary — Monte Fitz Roy 2026

    Organizer record: Concursos AG360 · Directory record not yet reviewedCompetition BriefMountain Sanctuary — Monte Fitz Roy 2026 is an open…

  • Model Young Package Competition 2026

    Competition BriefIntentThe Model Young Package Competition 2026 operates as a worldwide packaging design contest which targets emerging designers and students…

  • YICCA 22/23 – International Contest of Contemporary Art

    YICCA 22/23 – International Contest of Contemporary Art is now open for entries! YICCA 22/23 – International Contest of Contemporary Art: YICCA 22/23 – International Contest of Contemporary Art, an international competition for artist organized by Moho Association has been recently opened for entries with aim to promote the enrolled artists, giving them chance to

  • 13th ICMA International Creative Media Award

    13th ICMA International Creative Media Award is now open for entries! 13th ICMA International Creative Media Award: The 13th International Creative Media Award, a worldwide competition for custom media, books, corporate design and magazines, has been recently opened for entries and like every year has aim to exchange creative ideas on an international level. media

  • |

    International Design Competition for the (New) GOYANG CITY Hall

    1. NAMEInternational Design Competition for the (New) GOYANG CITY Hall (http://www.goyang-newcityhall.org)2.Background of Competition: Established in 1983, the current Goyang City…

  • Open Call: 2025 Osaka Expo Korea Pavilion Theme/Concept Competition

    Architecture Competition: Open Call: 2025 Osaka Expo Korea Pavilion Theme/Concept Competition[Overview of Osaka Expo]Period : 2025. 04. 13 ~ 10….

Leave a Reply

Your email address will not be published. Required fields are marked *