TECU ARCHITECTURE AWARD 2022 | جائزة TECU للهندسة المعمارية 2022

TECU ARCHITECTURE AWARD 2022

Home » Competitions » TECU ARCHITECTURE AWARD 2022

Architecture Competition: TECU ARCHITECTURE AWARD 2022

The TECU® brand of copper products for designing the building envelope provides architecture with high-quality and aesthetically pleasing materials. The TECU® ARCHITECTURE AWARD is intended to highlight developments in building culture with a focus on copper applications and to recognise new architectural solutions with TECU® products. The award is presented for the sixth time in 2021.

Projects submitted must have been created since 2016 using TECU® products. They should express the product application in an exemplary and innovative way. In any case, the overall architectural concept is just as decisive for the assessment as the specific use of materials.

All information and competition forms on the Award website www.KME.com/tecu-award.

Further Reading From ArchUp

  • Open Call for Open Source Design Library

    Open Source Design is that the development of ideas without the retention of property . The goal of this initiative…

  • Seoul Architecture Award

    Architecture Competition: Seoul Architecture Award The Seoul Metropolitan Government intends to present the “Seoul Architecture Award” to architects and citizens…

  • Open Call: MINIMUM SCHOOL LADAKH

    Architecture Competition: Open Call: MINIMUM SCHOOL LADAKH Ladakh is a cold desert in India. Lying in the Great Himalayan Region,…

  • Open Call for Design Teams: Valencia 360

    Non Architecture together with World Design Capital Valencia 2022 and Las Naves, is delighted to launch the Open Call for…

  • Student Project Awards 2025

    The Student Project Awards 2025 competition is an event where young architects are showing off their qualities to the world….

  • MBArch Entrepreneurship Challenge 2021 Launch

    Today’s rapidly changing world calls for entrepreneurs who question the status quo and are able to leverage people, resources, and…

Leave a Reply

Your email address will not be published. Required fields are marked *